3 revisions 0 plc 1 plc 2 plc 3 plc 4 plc angles of scale sheet rev name size cage code drawing no dimensions: tolerances unless otherwise specified: dwn chk apvd material finish product spec application spec weight p ltr date apvd dwn description loc dist 4 2 1 d b a a b c c d all rights reserved. released for publication c copyright this drawing is unpublished. 1471-9 (3/11) a2 restricted to this drawing is a controlled document. te connectivity 1-338084-3 4 pos./4 cont. 300 pcs on n360 mm od reel. top entry orientation per detail b1 1-338084-5 4 pos./4 cont. 2-338084-3 750 pcs on n560 mm od reel. top entry orientation per detail b1 4 pos./4 cont. 2-338084-5 750 pcs on n560 mm od reel. bottom entry orientation per detail b2 4 pos./4 cont. contact plating: overall: ni 1.27m min. all over the contacts solder zone: sn 3.5-5.0m on the solder zone of the contact mating zone: plating confirms to product requirements as per specification 108-19117 printed circuit board layout (top entry appl.) 4 required solder paste thickness 0.1mm min. 7 2 7 customer drawing 338084 e.v.eljk 30-sep-96 e.stellinga dec.'96 r.smeets - 5:1 1 2 aa 108-19117 114-19041 1.92 gr - - mm - - - - - - ir - invertible modular jack, 4 position handset surface mount application - 2011 2011 00779 te connectivity z housing rib strengthened and rawmaterial changed to pa4t 06jan2012 ps rrp aa eco-16-001320 13jun2016 ad sh 13.350.10 7.8 5.60 +0.10 0 ref. 2.2 4.6 3.4 typ. 1.27 14.0 2.3 6.75 2.2 x7.2mm 6.8 1.5 0.10 11.8 8.0 12.7 2.5 19.4 4.5 3.2 8.8 0.6 0.7 19.4 14.6 0.1 13.8 typ. 1.27 0.6 0.4 2.5 8.8 0.70 2.8 2.5 typ. 1.27 11,5 10 1,40,8 1,50,8 part number packaging remarks 300 pcs on n360 mm od reel. bottom entry orientation per detail b2 1-338084-6 300 pcs on n360 mm od reel. top entry orientation per detail b1 4 pos./4 cont. tolerances unless otherwise specified: #0.15. materials: housing: 30% g.f. lcp color black, ul 94v-0. contacts: phosphor bronze solder bracket: tin plated brass with nickel underplate. this jack can also be applied hanging through a hole, in a printed circuit board. see left pcb layout. surface can be used for picking the modular jack with, type ii smd machine. notes: 3 1 printed circuit board layout (bottom entry appl.) required solder paste thickness 0.1mm min. see note 3 see note 2 measured at heel of contacts coplanarity at tips of contacts max. 0.18mm tape and reel packaging according to eia 481-3 specifications. includes kapton tape (10x11,5mm) on top surface as pick and place feature. obsolete parts: obsolete cis streamlining per d.renaud/d.sinsi 4 plc 4 plc hole for bottom entry application 0.4r max. pad for pin 1 dashline indicates outline of jack, contacts and bracket pad for pin 1 pin 1 section a-a 5 5 6 5 6 8 8 9 9 9 5 0.10 5 2
3 revisions 0 plc 1 plc 2 plc 3 plc 4 plc angles of scale sheet rev name size cage code drawing no dimensions: tolerances unless otherwise specified: dwn chk apvd material finish product spec application spec weight p ltr date apvd dwn description loc dist 4 2 1 d b a a b c c d all rights reserved. released for publication c copyright this drawing is unpublished. 1471-9 (3/11) a2 restricted to this drawing is a controlled document. te connectivity - see sheet 1 - - - customer drawing 338084 e.v.eljk 30-sep-96 e.stellinga dec.'96 r.smeets - 5:1 2 2 aa 108-19117 114-19041 1.92 gr - - mm - - - - - - ir - invertible modular jack, 4 position handset surface mount application - 2011 2011 00779 te connectivity ref. 20 ref. 32 ref. 13 ref 37 top entry orientation. bottom entry orientation. see detail b1 & b2 detail b2 scale 4:1 typical see detail b detail b 1 scale 4:1 round hole oval hole oval hole round hole 5
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